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                DIP Package

                DIP Package

                Overview of Characteristic

                • Support Wi-Fi IEEE802.11b/g/n and BLE4.2 Wireless Standards
                • Based on ARM9E SOC, 120MHz CPU, 256KB RAM, 2MB Flash
                • Support UART Data Communication with Wi-Fi or BLE 
                • Support Wi-Fi STA/AP/AP+STA Mode
                • Support Wi-Fi Sniffer SmartLink V8, WeChat Airkiss 2.0 Config
                • Support Wi-Fi AP SmartAPLink Config
                • Support BLE SmartBLELink Config
                • Support Wireless and Remote Firmware Upgrade Function
                • Support Software SDK for Develop
                • Support Internal PCB or External IPEX Antenna Option
                • Single +3.3V Power Supply
                • Size: 23.1mm x 32.8mm x 3.5mm,SMT34 package

                Sizing Table

                Name HF-LPC330  >>
                Image HF-LPC330
                Wireless Standard 802.11b/g/n BLE 4.2
                Key Feature Support Software SDK for Develop
                Processor ARM9E SOC
                Basic Frequency 120MHz
                Operating System alios
                Temp. Range -40~+85
                Internal Antenna
                I-PEX Connector
                Size (mm) 22mm x 15.6mm x 8mm
                Package Type DIP10
                Work Voltage 3.0~3.6V
                Current @No data 25mA
                Current @Tx Peak 260mA
                Resource-Flash 2MB
                Resource-RAM 256KB
                Interface-UART 2
                Interface-PWM PWM0~PWM5
                Interface-SPI 1
                Interface-GPIO
                AP Mode
                STA Mode
                AP+STA Mode
                WPS Function
                Web Server
                OTA Upgrade
                Airkiss Configure
                SDK Support